Here are details, I also included the 1 reference lecture slide and project sample (but project sample is for different topic). I need 4 pages on this not including the reference page.
Project#3 3D Packaging
Chip on Chip, Wafer on Wafer, Package on Package stacking, interconnects like Though Silicon Vias, Through Package Vias, Assembly/processes, advantages/disadvantages etc
•Literature review summary (with at least 8 references)
•Challenges foreseen connecting to technology demands and/or Applications , at least one
new/emerging concept needs to be discussed at length.
•Minimum Four pages ( max 6 pages) write-up – references need to be on the additional page
•Format: Introduction, Description of the technology, Uniqueness, Advantages/Disadvantages, Discussion/Inference, Conclusions & recommendations for future work, References.
Font size Times New Roman 12, Heading and subheadings in bold.
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