i only need Q1, Q4, Q7, Q6 and Q11 and plz high

Consumer Assessment of Healthcare Providers and Systems (HCAHPS) scores, employee satisfaction, salary, etc. The customers are the service line director and patients.

In order to measure improvement, the team decided to call upon the overall time it took to produce the nursing report. The cycle time of staff punch in is 10 seconds, the Transaction Time I before they put away their belongings is another 10 seconds, and they need 2 minutes to put away the belongings. And 10 more seconds are needed to get the assignment after 2 minutes Transaction Time II. The report is given individually, so the cycle time of reporting with the 1st nurse is 7 minutes, reporting with the 2nd nurse is 6 minutes, and reporting with the 3rd nurse is also 6 minutes. There are transaction times between each procedure, so Transaction Times III, IV, V are all 5 minutes. The total lead time of the current nursing shift change process is 43 minutes, which is considered as a defect. The objective of this effort is to decrease it to 30 minutes.

To begin addressing potential solutions for non-value-added (NVA) wait time, the team completed a failure mode and effects analysis (FMEA) chart. This analysis is a complete and quantified cause and effect chart that pinpoints potential reasons why the shift-change report is taking so long to complete. Included in the FMEA is a risk priority number, which suggests the factors that should take the highest priority in promoting change. There are six steps for completing the FMEA:

1. Analyze what may be causing a long nursing report.

2. Identify how the step can go wrong.

3. Identify what impact the step has on the nursing report.

4. Determine potential causes for the problem.

5. Assess potential controls that exist for the problem.

6. Identify how to reduce the likelihood of the problem.

Upon observing and analyzing the data, the team identified a key area for most effectively eliminating waste. It was clear that the most significant and controllable source of unnecessary payroll expenditures existed in the number of nurses involved in producing the shift-change reports. After deploying the process change, the average lead time to complete the nursing shift change report has been reduced to 30 minutes.

As a Lean Six Sigma Green Belt, please answer the following questions (feel free to state any assumptions that might be necessary for you to address the following questions):

1. Identify the stakeholders and their roles in this project and discuss their potential impact or concerns (30 points).

Calculate the absolute value and relative value for the QFD provided below. (MAR = medication administration record, TAT = turnaround time) (30 points).

13. Fifty observations of nursing shift change duration are collected for the period before the Lean Six Sigma Project (Pre Shift Change Time) and after the Lean Six Sigma Project (Post Shift Change Time). Construct an I-chart (Hint: The individual chart (I-Chart) is used to detect trends and shifts in the data, and thus in the process.) for both pre-process and post-process for the nursing shift change duration based on the data provided in the LSSGB_Final_Exam_December_2021.xls Excel file (25 points). This was not covered in the program, so you might need to read about I-Charts before answering the question.

14. Based on your understanding of the problem, list at least five ideas as your improvement plan? What would you recommend in your control plan to ensure sustainable improvements? (30 points)

Question 2 [50 Points]: Andy is a quality manager in a display development company. He found some quality issues about a heatsink hole on the printed circuit board (PCB) when developing the heatsink. A heatsink absorbs and dissipates heat from an electronic component through contact with PCB, or thermal interface material, which increases the thermal mass and heat dissipation (conduction/convection). To improve the manufacturing process of the heatsink hole, he measures the

Question 3 [55 Points]: Printed Circuit Boards (PCBs) are becoming more sophisticated due to the increasing market demands on complex electronics. Therefore, it is very crucial to maintain an excellent quality while manufacturing PSBs. An innovation PCBs manufacturing company manufactures multilayer’s PCBs using surface-mounted technology (SMT). The major manufacturing processes in the company are solder screening, component placement, and solder reflow. Solder screening is the most critical process in PCB manufacturing which is performed to avoid any defect in the solder joint during manufacturing that may cause a circuit failure. The solder paste volume (height) transferred onto the

PCB is the most important factor that needs to be controlled carefully to maintain a low level of variation. The solder screening process transferred the solder pasted onto the solder pad of the PCB. The application method of solder paste is printing, and the printing technique used is off-contact printing in which there is a snap-off distance between a stencil and a PCB. The type of screening The machine used to manufacture products is semi-automatic. As the squeegee system consists of the front and back blades, there are two types of printing, front printing, and back printing. In current practice, both front and back printing are used alternatively during printing. During a printing process, two PCBs are placed side-by-side on the holder of a screening machine. The solder paste is then manually placed onto a stencil before printing. The front/back blade makes line contact with the stencil and close contact with the given amount of solder paste. The solder paste is then rolled in front of the front/back blade. So, solder paste is pressed against the stencil and transferred onto the solder pad through the stencil openings.

The Lean Six Sigma team found that the screening process during PCB manufacturing has a low capability and needed to be improved. Many DMAIC approaches were used to increase the screening process capability. DOE was performed to determine which of the critical-to-quality factors mostly affect the screening process capability by studying the solder past height. Five factors were tested using DOE. A full factorial experiment was carried out. There were 48 types of printing, and two PCBs were measured for

each type of printing. In total, 96 PCBs were measured, and 480 solder paste height data were collected for analysis. The experimental conditions are as follows: (1) Room temperature: 25 oC, (2) Room humidity: 58%, (3) Machine number: 12, (4) Stencil number: 25 (new), (5) Number of operators: 1, (6) Model: Neptune, (7) Snap-off distance: nearly zero, (8) Point locations: J1, U1, U1, U2, U2, and (9) Specification: (4.5-7) mil. The factors and their levels in the experiment are given in below. Please review the results and then answer the questions below:

1. Name the factors that were tested and list their levels? (10 points)

2. What are the significant factors that affect the process? (10 points)

3. Explain the main effects plot and the interaction effects plot? (15 points)

4. What can be concluded from the previous analysis? What is the optimal solder height variation that results from the best combination of variables? (20 points)

6. The performance improvement specialist on your team suggests several process changes that result in reducing the turnaround time by 6 hours for each report. Reconstruct the X-bar and R charts and comment on the results (25 points).

7. Based on your answers in Parts 3 and 6, plot the control charts for the ‘before’ and ‘after’ situation on the same chart (using Excel) (15 points).

Observations (Turnaround time in hours)

Day	1	2	3	4	5	6	7	8	9	10
1	11	12	21	18	35	16	18	22	11	23
2	13	19	20	18	16	6	21	5	15	5
3	8	1	16	8	16	23	12	5	7	22
4	7	9	19	9	11	10	21	17	19	6
5	1	14	9	18	18	22	20	8	11	16
6	13	4	17	5	6	22	17	5	18	26
7	15	15	9	6	21	23	16	7	3	9
8	17	3	5	13	23	3	11	22	15	5
9	5	2	12	17	8	14	21	21	20	19
10	17	19	7	8	22	17	7	14	14	21
11	20	20	18	23	15	11	23	8	15	33
12	10	6	23	22	3	6	17	19	12	9
13	1	23	24	7	8	3	20	11	22	1
14	12	25	23	13	16	8	21	13	12	4
15	7	17	4	13	2	17	4	4	15	6
16	4	14	20	5	1	10	21	14	21	13
17	3	11	13	14	6	11	15	23	23	20
18	20	1	13	11	10	19	19	21	21	16
19	19	3	5	12	22	9	15	2	22	7
20	13	11	5	17	21	20	18	11	17	8
21	14	23	8	12	18	8	19	9	30	6
22	12	22	11	17	20	3	2	1	23	3
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